Packaging Module Development Engineer

Intel(1 month ago)

HybridFull TimeMedior$133,800 - $188,890Advanced Packaging Technology Manufacturing (APTM) - Assembly Technology Development (ATD)

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About this role

A Packaging Module Development Engineer in Intel’s Advanced Packaging Technology Manufacturing (APTM) division contributes to the development and commercialization of advanced semiconductor packaging technologies. The role supports scaling interconnect and thermal solutions for Intel’s packaging platforms and works closely with foundry customers and cross-functional teams to enable high-volume manufacturing.

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Required Skills

Interconnect
Thermal Solutions
Process Optimization
Equipment Development
Project Management
SPC
DOE
Sustaining Engineering
Technical Leadership
Semiconductor Fabrication

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Qualifications

PhD
Minimum GPA 3.5
Peer-Reviewed Publication

About Intel

intel.com

Intel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.

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