Packaging Module Equipment Development Engineer

Intel

2 days ago

3.7 on Glassdoor

Arizona

Onsite

Full Time

Senior

0 applicants

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About this role

A Packaging Module Development Engineer at Intel works on developing and commercializing semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. The role involves innovating package assembly solutions, optimizing assembly processes, and managing projects to meet product development timelines.

Skills

Qualifications

PhD in Materials SciencePhD in Mechanical EngineeringPhD in Electrical EngineeringPhD in Physics/Applied PhysicsMinimum GPA of 3.5

About Intel

intel.com

Intel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.

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Intel Corporation (INTC) is a leading American manufacturer of semiconductor computer circuits . It is headquartered in Santa Clara , California. The company’s name comes from integrated electronics.

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