Semiconductor Assembly Process Development Enginner
Renesas Electronics
About this role
This role involves working on cutting-edge semiconductor packaging technologies, including assembly, packaging, and testing of advanced package types such as FCCSP and FCLGA. The position offers the chance to contribute to innovations in high-density, high-reliability packages for AI, HPC, automotive, and IoT applications, supporting the development of next-generation semiconductor products.
Skills
Qualifications
About Renesas Electronics
renesas.comRenesas Electronics Corporation is a global semiconductor company that designs and supplies microcontrollers, analog, power management and system-on-chip (SoC) products for embedded applications. Its product portfolio targets automotive, industrial, IoT, infrastructure and consumer markets and includes scalable MCUs, mixed-signal and power ICs, connectivity and security building blocks, plus development tools and software. Renesas emphasizes reliability, functional safety and trusted design support, working with customers and partners to accelerate embedded system development and deployment.
About Renesas Electronics
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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Salary
$80k – $120k
per year