Photonics Packaging Engineer
IonQ(1 day ago)
About this role
IonQ is seeking a Photonics Packaging Engineer to support development and implementation of fiber‑packaged integrated photonic devices for deployable quantum computers. The role involves collaborating with scientists and engineers to design, test, and optimize low‑loss fiber‑chip interfaces and optical packaging processes to enable scalable production. The position is based onsite in Boston and supports cryogenic device benchmarking and vendor scaling efforts.
Required Skills
- Fiber Optics
- Active Alignment
- Photonic Packaging
- Nanofabrication
- Optical Testing
- Cryogenic Testing
- CAD
- Process Development
- Automated Assembly
- Vendor Management
Qualifications
- Undergraduate Degree in Electrical Engineering, Mechanical Engineering, Physics, Optics, or Related Field
About IonQ
ionq.comIonQ builds trapped‑ion quantum computers and full‑stack systems designed to tackle complex computational problems. Their platform combines high‑fidelity trapped‑ion qubits, control hardware, and developer tools to deliver quantum processing via cloud integrations and APIs. IonQ targets applications in chemistry, optimization, machine learning, and finance while working with enterprises, researchers, and cloud providers to make quantum computing broadly accessible.