Photonics Packaging Engineer
IonQ
About this role
IonQ is seeking a Photonics Packaging Engineer to support development and implementation of fiber‑packaged integrated photonic devices for deployable quantum computers. The role involves collaborating with scientists and engineers to design, test, and optimize low‑loss fiber‑chip interfaces and optical packaging processes to enable scalable production. The position is based onsite in Boston and supports cryogenic device benchmarking and vendor scaling efforts.
Skills
Qualifications
About IonQ
ionq.comIonQ builds trapped‑ion quantum computers and full‑stack systems designed to tackle complex computational problems. Their platform combines high‑fidelity trapped‑ion qubits, control hardware, and developer tools to deliver quantum processing via cloud integrations and APIs. IonQ targets applications in chemistry, optimization, machine learning, and finance while working with enterprises, researchers, and cloud providers to make quantum computing broadly accessible.
Recent company news
IonQIonQ & University of Cambridge Launch Quantum Innovation Centre
1 day ago
StockStoryStocks making big moves yesterday: Saia, Oracle, Atlas Energy Solutions, IonQ, and Conagra
29 minutes ago
The Globe and MailIonQ Files Prospectus for Cambridge Share Resale Arrangement
4 hours ago
The Motley FoolPrediction: IonQ Will Be the First Quantum Stock to Prove the Bears Wrong
18 hours ago
BeBeez InternationalIonQ partners with the University of Cambridge for 256-qubit quantum computer
2 hours ago
About IonQ
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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View leadership team, funding history,
and employee contacts for IonQ.
Salary
$110k – $144k
per year