Micron Technology
Micron Technology is seeking an experienced physical design engineer to lead end‑to‑end physical design for high‑bandwidth memory (HBM) base and memory dies. The role involves floorplanning, power planning, placement, routing, timing closure, and sign‑off for advanced‑node, high‑density designs, while collaborating with cross‑functional teams across architecture, PHY, packaging, and test.
Micron Technology, Inc. is a global leader in semiconductors, specializing in the design and manufacturing of memory and storage solutions including DRAM, NAND flash, HBM, and SSDs. The company serves a broad range of markets including AI and data centers, automotive, mobile, client PC, and industrial IoT. Headquartered in Boise, Idaho, Micron is recognized for its technology leadership and ongoing U.S. manufacturing expansion.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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and employee contacts for Micron Technology.
Micron Technology didn’t post a salary, so this is our estimate from similar listings.
16% below the average for this role
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