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© All Rights Reserved. ApplyBlast.com
Kandou
The Principal Development Engineer leads the electrical and mechanical optimization of connector interfaces, cable assemblies, and PCB interfaces for high-speed interconnect products. This role involves driving the interconnect architecture from early concept through electromagnetic simulation, validation, and lab measurement. The position requires close collaboration with cross-functional teams to deliver signal-integrity-optimized and manufacturable solutions.
Kandou AI develops revolutionary Copper MIMO (Chord Signaling) interconnect technology that unlocks the full potential of copper links for AI infrastructure. Their technology reimagines how memory, compute, and rack-scale connectivity work together, delivering over 10X lower cost, 3X lower power, and 8X more scale compared to traditional approaches. Kandou's products span PCIe retimers, USB4 retimers, PCIe switches, and chiplet interconnect IP targeting AI inference, CXL memory platforms, and high-speed networking applications.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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