Principal Engineer, Hardware - Advanced Packaging
ASM
About this role
A Principal Engineer (Hardware) at ASM focuses on advancing semiconductor process technologies through research, development, and optimization of advanced packaging processes. The role involves complex experimentation, troubleshooting, and providing technical support for semiconductor equipment and systems.
Skills
Qualifications
About ASM
asm.comASM is a leading semiconductor-equipment company that builds machines enabling the production of smaller, more advanced chips. The company specializes in high‑precision deposition and wafer processing technologies (such as atomic layer deposition, epitaxy and related CVD processes), plus process integration and automation used by foundries and fabs. Combining intensive R&D, systems engineering and global service, ASM delivers high‑throughput, high‑accuracy tools that help chipmakers scale nodes, improve yield and accelerate innovation.
Recent company news
Rowena Smith and Mark Chalmers Discuss the ASM and Energy Fuels Partnership at PDAC 2026
24 hours ago
Avino Silver & Gold Mines Ltd (ASM) Q4 2025 Earnings Call Highlights: Record Revenues and ... By GuruFocus
17 hours ago
ASM’s Sales Outlook Beats Estimates as China Demand Rebounds
1 week ago
Energy Fuels to acquire Australian Strategic Materials to create new "mine-to-metal & alloy" rare-earth champion
1 month ago
Energy Fuels' Planned Acquisition of ASM in Mid-2026 Would Give the Company Control Over Every Step of Rare Earth Production
3 weeks ago
About ASM
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
Unlock Company Insights
View leadership team, funding history,
and employee contacts for ASM.
Salary
$102k – $152k
per year
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