Packaging Module Development Engineer

Intel(6 days ago)

Phoenix, AZ, ArizonaOnsiteFull TimeSenior$115,110 - $219,550Engineering

About this role

A Packaging Module Development Engineer at Intel's Advanced Packaging Technology Manufacturing division focuses on developing and scaling innovative semiconductor packaging solutions for high-volume manufacturing. The role involves collaborating with multifunctional teams to advance packaging technologies, lead equipment development projects, and support process optimization for semiconductor assembly.

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Required Skills

Python
MATLAB
Design of Experiments
Statistical Process Control
Semiconductor Manufacturing

About Intel

intel.com

Intel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.

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