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© All Rights Reserved. ApplyBlast.com
Micron Technology
This role owns next-generation HBM core-die architecture and critical DRAM circuit design to impact bandwidth, power, area, thermal efficiency, and long-term reliability. The engineer drives architecture definition, circuit feasibility, and Architecture Reference Design development across advanced 3D-stacked HBM products. The position supports the design and deployment of AI-enabled solutions to improve efficiency and decision-making.
Micron Technology, Inc. is a global leader in semiconductors, specializing in the design and manufacturing of memory and storage solutions including DRAM, NAND flash, HBM, and SSDs. The company serves a broad range of markets including AI and data centers, automotive, mobile, client PC, and industrial IoT. Headquartered in Boise, Idaho, Micron is recognized for its technology leadership and ongoing U.S. manufacturing expansion.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Micron Technology.