Principal Microelectronic Packaging Engineer

The Principal Microelectronic Packaging Engineer will lead the development of next‑generation microelectronic packaging technologies to make assemblies smaller, faster to manufacture, more reliable, and cost‑effective. This role involves driving miniaturization and optimization through prototyping, experiments, and material analysis, while guiding cross‑functional engineering teams and coordinating with manufacturing and sourcing partners. The position is based in Eden Prairie, Minnesota and reports to the Engineers department.