Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering
Eightfold(3 months ago)
About this role
Micron is seeking an Advanced Packaging Integration Engineer to join their Advanced Packaging Technology Development team. The role focuses on developing and enabling advanced packaging technologies for high-performance memory products while ensuring integration and collaboration with various teams to drive technology development strategies. This position plays a key role in addressing challenges in packaging processes to support the growth of innovations in artificial intelligence and related technologies.
Required Skills
- Advanced Packaging Technology
- Yield Improvement
- Data Analysis
- Process Integration
- Collaboration
Qualifications
- B.S/M.S./Ph.D. in Electrical Engineering
- Mechanical Engineering
- Chemical Engineering
- Physics
- Material
About Eightfold
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