Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering
micron
About this role
Micron is seeking an Advanced Packaging Integration Engineer to join their Advanced Packaging Technology Development team. The role focuses on developing and enabling advanced packaging technologies for high-performance memory products while ensuring integration and collaboration with various teams to drive technology development strategies. This position plays a key role in addressing challenges in packaging processes to support the growth of innovations in artificial intelligence and related technologies.
Skills
Qualifications
About micron
micron.comMicron Technology, Inc. is a global leader in semiconductors. It provides a broad range of performance-enhancing memory and storage solutions. Headquartered in Boise, Idaho, Micron serves customers worldwide with its memory and storage products. The company is recognized for its global reach and leadership in the semiconductor industry.
About micron
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
Unlock Company Insights
View leadership team, funding history,
and employee contacts for micron.
Salary
$108k – $142k
per year
More jobs at micron
Similar Jobs
Sr. Principal Engineer, Advanced Packaging
Marvell Technology
Senior MTS, Advanced Packaging Integration
Applied Materials
Advanced Packaging Technology Pathfinding and Development Engineer
Marvell Technology
Technical Director, Advanced Packaging Integration
Applied Materials
External Technology Integration Engineer
Intel
Senior MTS, Advanced Packaging Integration
Applied Materials