Senior MTS, Advanced Packaging Integration
Applied Materials(2 months ago)
About this role
Applied Materials is hiring an Advanced Packaging Integration Engineer in Singapore to support its Advanced Packaging Disruptive Technology team. The position is a technical staff role centered on innovating and integrating advanced panel-level packaging technologies with an emphasis on thin-film deposition and etch. The role interfaces with customers and internal teams to bring new advanced packaging capabilities from development into manufacturing.
Required Skills
- Advanced Packaging
- Process Integration
- Panel-Level Packaging
- Thin Film Deposition
- Dielectric Etch
- PVD
- CVD
- PECVD
- ALD
- ECD
+12 more
Qualifications
- BS in Electrical Engineering
- BS in Materials Science
- BS in Chemical Engineering
- MS in Electrical Engineering
- MS in Materials Science
- MS in Chemical Engineering
- PhD in Electrical Engineering
- PhD in Materials Science
- PhD in Chemical Engineering
About Applied Materials
appliedmaterials.comApplied Materials is a global leader in materials engineering solutions that enable the production of virtually every new semiconductor chip and advanced display. The company designs, manufactures and services equipment, software and process technologies across semiconductor fabrication (deposition, etch, implantation, inspection/metrology, CMP, ALD/CVD/PVD), advanced packaging and display manufacturing. Its customers include chipmakers, foundries and display manufacturers worldwide, and it provides process integration, factory automation and lifecycle services to improve yield, performance and cost. Headquartered in Santa Clara, California, Applied Materials combines deep R&D and scale to drive device scaling, energy efficiency and new architectures.
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