Principal/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering
Eightfold(4 months ago)
About this role
The role focuses on developing and enabling deployment processes related to post-fab wafer finishing in semiconductor manufacturing, aiming to meet performance, cost, quality, and reliability standards. It involves working across multiple teams to develop new technologies and improve existing processes to support advancements in high-performance memory products.
Required Skills
- process Development
- Wafer Thinning
- Data Analytics
- Equipment Evaluation
- Process Optimization
- Material Evaluation
- Automation
- Quality Control
- Semiconductor Manufacturing
- Process Modeling
About Eightfold
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