Process Support Engineer III - (E3) - AP PVD

Applied Materials(2 months ago)

Hsinchu, TaiwanOnsiteFull TimeSenior$138,830 - $187,813 (estimated)Advanced Packaging

About this role

Applied Materials is hiring a Process Support Engineer in Hsinchu to support semiconductor advanced packaging process technologies, with emphasis on PVD for wafer-level packaging and metallization. The role partners closely with customers and internal R&D/cross-functional teams to help bring next-generation semiconductor packaging solutions from development through qualification and ongoing support.

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Required Skills

Process Engineering
Physical Vapor Deposition
Wafer-Level Packaging
Metallization
Customer Support
Equipment Installation
System Diagnosis
Equipment Repair
Design Of Experiments
Statistical Analysis

+11 more

Qualifications

Master’s Degree

About Applied Materials

appliedmaterials.com

Applied Materials is a global leader in materials engineering solutions that enable the production of virtually every new semiconductor chip and advanced display. The company designs, manufactures and services equipment, software and process technologies across semiconductor fabrication (deposition, etch, implantation, inspection/metrology, CMP, ALD/CVD/PVD), advanced packaging and display manufacturing. Its customers include chipmakers, foundries and display manufacturers worldwide, and it provides process integration, factory automation and lifecycle services to improve yield, performance and cost. Headquartered in Santa Clara, California, Applied Materials combines deep R&D and scale to drive device scaling, energy efficiency and new architectures.

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