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© All Rights Reserved. ApplyBlast.com
Foxconn
This role focuses on New Product Introduction (NPI) processes within manufacturing or product engineering, specifically for electronics or hardware industries. Key duties include managing Bill of Materials (BOM) in SAP, conducting packaging validation, defining tooling, and overseeing Engineering Change management on the shop floor. Candidates should possess specialized competencies in quality tools, failure analysis methods, and database management alongside relevant educational backgrounds.
Headquarters
Longgang District, Guangdong, China
Company Size
10001+ employees
Founded
2015
作为全球领先的智能制造及工业互联网整体解决方案服务商，工业富联始终坚持“深耕中国、布局全球”经营策略，工业富联发挥国内国外双循环的桥梁和纽带作用，基于超过30年的高端智能制造的行业数据经验，大力推动ICT全产业链的数字化转型，已发展成为全球数字经济领军企业，居电子制造服务产业全球第二，持续为数字经济高质量发展贡献力量。
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Foxconn.
16% below the average for this role
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