GlobalFoundries
GlobalFoundries is seeking a motivated R&D bonding integration engineer to join the Quantum Advanced Packaging team, focusing on 3D heterogeneous integration development including wafer-to-wafer and die-to-wafer bonding. The role involves driving process development efforts, collaborating with outsourced assembly and test partners, and developing integration schemes to improve yields and reduce costs. This position offers opportunities for mentorship, networking, and leadership within a fast-paced work environment.
Headquarters
Malta, New York, United States
Company Size
10001+ employees
Founded
2009
GlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for GlobalFoundries.
GlobalFoundries Announces Secondary Public Offering of 20 Million Shares and $300 Million Share Repurchase Initiative
18 hours ago
Packaging Engineer V E5 Santa Clara Ca
Applied Materials
Temporary Wafer Bonding & Debonding (R&D)
ASTARPRD
Scientist
ASTARPRD
Scientist/Senior Scientist – Process Integrator / Hybrid Bonding/ Heterogeneous Integration
ASTARPRD
Process Development Engineer
ASTARPRD
Copper-to-Copper (C2C) Bonding Expert
Samsung US