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R&D Engineer: Test Engineering Wafer Test, Final Module Test & Characterization at Broadcom - ApplyBlast

R&D Engineer: Test Engineering Wafer Test, Final Module Test & Characterization

Broadcom

2 days ago

3.3 on Glassdoor

Regensburg, Bavaria, Germany

Onsite

Full Time

Medior

0 applicants

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About this role

This role involves developing device testing at the wafer, die, and module levels for optoelectronic transceiver and sensor products, as well as in-house mixed-signal ASICs and sensor chips. The position requires defining test requirements, developing test hardware and software, and characterizing devices under various conditions. The engineer will collaborate with design teams, analyze test data, and optimize test solutions for cost-efficiency.

Responsibilities

Develop device testing at wafer, die, and module levels
Design test application PCBs, sockets, and probe cards
Optimize productive test packages for cost efficiency

Skills

Qualifications

Master’s Degree in Electrical EngineeringMaster’s Degree in PhysicsPhD in Electrical EngineeringPhD in Physics

About Broadcom

broadcom.com

Headquarters

Palo Alto, California, United States

Company Size

10001+ employees

Founded

1991

View Profile

Broadcom Inc. is a global technology leader that designs, develops, and supplies a comprehensive range of semiconductor and enterprise software solutions. The company's offerings include a variety of security solutions and products aimed at enhancing connectivity across various sectors. With a commitment to innovation and quality, Broadcom is at the forefront of driving technological advancements that connect everything, from data centers to mobile devices.