GlobalFoundries
GlobalFoundries Fab8 is seeking an experienced R&D Engineer to join the Advanced Packaging Lab and lead advanced 3D Heterogeneous Integration initiatives, including wafer-to-wafer and die-to-wafer hybrid bonding, TSV/TOV, and interposer development. The role involves driving process development, collaborating with internal teams and external vendors, and managing end-to-end process integration for new packaging capabilities. The engineer will also be responsible for data analysis, troubleshooting, and generating intellectual property related to novel wafer integration technologies.
Headquarters
Malta, New York, United States
Company Size
10001+ employees
Founded
2009
GlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for GlobalFoundries.
6% below the average for this role
GlobalFoundries Announces Secondary Public Offering of 20 Million Shares and $300 Million Share Repurchase Initiative
18 hours ago
Sr. Advanced Packaging Si Interposer Process Integration and Development Engineer
SkyWater Technology Foundry, Inc.
Packaging Engineer V E5 Santa Clara Ca
Applied Materials
Hybrid Bonding Process Development Engineer
Applied Materials
Principal Scientist
ASTARPRD
Scientist/Senior Scientist – Process Integrator / Hybrid Bonding/ Heterogeneous Integration
ASTARPRD
Principal / Senior Principal Scientist (Lead, 3D IC Package Integration), Advanced Packaging
ASTARPRD