Principal Scientist

The Principal Scientist role at the Institute of Microelectronics focuses on advancing state-of-the-art advanced packaging technologies, including flip-chip bonding, FOWLP, and hybrid bonding processes. This position involves developing cutting-edge heterogeneous integration process flows for 2.5D and 3D packaging applications while conducting electrical and reliability characterization. The role offers an opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.