TTM Technologies
The R&D Process Development Engineer is responsible for developing, characterizing, and scaling advanced manufacturing processes for Semi-Additive Plating (SAP) build-up technology within a PCB manufacturing environment. This role requires bridging the gap between scientific research and production by optimizing processes in mechanical processing, lithography, electroplating, and etching. The position involves running controlled experiments, evaluating new equipment, and solving complex technical problems to support customer needs across various markets.
Headquarters
Santa Ana, California, United States
Company Size
10001+ employees
Founded
1998
TTM Technologies is a global advanced printed circuit board (PCB) manufacturer and RF supplier delivering high-performance circuit solutions for aerospace, defense, communications, medical and industrial markets. It offers a broad portfolio of rigid, flex, RF/microwave and advanced-substrate PCBs along with engineering support, assembly and supply-chain services. TTM emphasizes innovation, quality and sustainability, holding industry certifications and operating manufacturing and support facilities worldwide. Customers rely on TTM for its technology expertise, scale and integrated solutions for complex electronic systems.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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TTM Technologies didn’t post a salary, so this is our estimate from similar listings.
37% above the average for this role