Research Fellow [Thermo-Mechanical Simulation]

The ECE Department at NUS is seeking a Research Fellow to drive the development and deployment of advanced modeling and simulation methodologies for next-generation semiconductor packaging technologies, including Integrated Silicon Photonics solutions. The successful candidate will play a key role in supporting 2.5D, 3D, chiplet, and heterogeneous integration programs through predictive simulation of thermo-mechanical behavior, package reliability, and manufacturing process interactions. This position offers a unique opportunity to conduct cutting-edge research in thermal, mechanical, and reliability modeling, enabling the development of advanced packaging solutions for AI, HPC, datacenter, and communication applications.