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Semiconductor Assembly Process Development Engineer at Renesas 瑞萨电子 - ApplyBlast

Semiconductor Assembly Process Development Engineer

Renesas 瑞萨电子

4 months ago

Yonezawa, Yamagata

Hybrid

Full Time

Senior

0 applicants

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About this role

This role requires a Senior Process Development Engineer to lead technology advancements in semiconductor back-end processes, specifically focusing on advanced packaging like FCCSP and FCBGA for AI, HPC, and automotive markets. The candidate will drive material and process improvements, manage production line setups, and enhance yield and quality standards. Proficiency in Japanese and English is mandatory, along with extensive hands-on experience in assembly, molding, grinding, and testing.

Responsibilities

Develop advanced packaging technologies including FCCSP and FCBGA
Drive material and process development for assembly improvements
Support production line setup and transition to mass production
Lead process quality improvements and yield enhancement activities
Evaluate assembly processes such as molding and package sawing

Skills

Qualifications

Bachelor’s degree in Mechanical EngineeringBachelor’s degree in Materials ScienceBachelor’s degree in ElectronicsBachelor’s degree in Chemistry5–7 years of experience in semiconductor back-end processes