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© All Rights Reserved. ApplyBlast.com
Renesas Electronics
A semiconductor company is seeking an experienced engineer to develop advanced package technologies such as FCCSP and FCBGA for AI, HPC, automotive, and IoT applications. The role involves technical development, process improvement, and supporting manufacturing scale-up in the semiconductor post-processing field.
Renesas Electronics Corporation is a global semiconductor company that designs and supplies microcontrollers, analog, power management and system-on-chip (SoC) products for embedded applications. Its product portfolio targets automotive, industrial, IoT, infrastructure and consumer markets and includes scalable MCUs, mixed-signal and power ICs, connectivity and security building blocks, plus development tools and software. Renesas emphasizes reliability, functional safety and trusted design support, working with customers and partners to accelerate embedded system development and deployment.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Renesas Electronics.
Semiconductor Assembly Process Development Engineer
Renesas 瑞萨电子
Process Engineer
Renesas 瑞萨电子
Semiconductor Assembly Process Development Engineer
Renesas 瑞萨电子
Advanced Semiconductor Package Design & Development Leader
Renesas 瑞萨电子
Assembly Technician- Semiconductor
MSR-FSR
Assembly Technician- Semiconductor
MSR-FSR