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infineon
This role leads the definition, design, and development of semiconductor packaging solutions from concept through realization, ensuring they meet electrical, thermal, mechanical, and reliability requirements. The position serves as a technical expert and consultant for package design and assembly technologies, driving innovation and cross-functional collaboration. The role involves scouting new packaging technologies, developing technical publications and patents, and supporting business divisions with BE assembly technology expertise. Candidates should have a Bachelor's Degree in Engineering and over 10 years of experience in the IC/semiconductor environment.
Infineon Technologies is a global semiconductor company that delivers chips and system solutions for automotive, industrial, IoT, and consumer markets. Its product portfolio includes microcontrollers, sensors, power-management ICs and power semiconductors (e.g., MOSFETs/IGBTs), memories, connectivity (USB, Bluetooth, Wi‑Fi), LED drivers, security controllers and radiation‑hardened devices. Infineon focuses on energy efficiency, safety and security to enable applications from electric vehicles and industrial drives to smart-home and IoT devices. OEMs and system designers choose Infineon for its integrated hardware/software solutions, reliability, and global support.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for infineon.
infineon didn’t post a salary, so this is our estimate from similar listings.
40% below the average for this role
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