Senior Die Bond Equipment & Process Engineer
Nexperia(26 days ago)
About this role
A Senior Die Bond Equipment & Process Engineer in semiconductor manufacturing who provides technical ownership of die bond equipment and associated processes to ensure production quality and reliability. The role works closely with R&D and manufacturing teams to support product introductions and continuous improvement efforts.
Required Skills
- Die Bond
- Buyoff Machines
- Process Optimization
- Troubleshooting
- Data Analysis
- Continuous Improvement
- FMEA
- Control Plan
- OCAP
- SPC
+6 more
Qualifications
- Bachelor’s Degree in Electrical/Electronic, Mechanical, Materials Science or related field
About Nexperia
nexperia.comHeadquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.
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