Nexperia
A Senior Die Bond Equipment & Process Engineer at a semiconductor manufacturing company leads die bond equipment setup, qualification, and optimization, collaborates with cross-functional teams, and drives continuous process improvements.
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Nexperia.
Nexperia didn’t post a salary, so this is our estimate from similar listings.
Nexperia China says it has begun producing its own chips
2 days ago
Senior / Principal Process Engineer – Die Bond
Lumentum
Wire Bond Equipment Engineer
NXP Semiconductors
FE ASSY DIE BOND PROCESS TECHNICIAN
NXP Semiconductors
FE ASSY DIE BOND PROCESS TECHNICIAN
NXP Semiconductors
Assistant Engineer
vishayintertechnology.com
Assistant Engineer
Vishay Semiconductor Malaysia Sdn Bhd