Navitas Semiconductor
Navitas Semiconductor is seeking a Senior Director, Package Design & Engineering to lead the package architecture, design, development, and qualification for its GaN and SiC product portfolio. This role involves defining the package technology roadmap, guiding global engineering execution, and building high-performing teams to deliver robust package platforms. The position requires deep technical expertise in power semiconductor packaging and strong leadership skills to drive innovation and execution across the organization.
Headquarters
Torrance, California, United States
Company Size
201-500 employees
Founded
2014
Navitas Semiconductor is the only pure-play, next-generation power semiconductor company, founded in 2014 to enable a high-speed revolution in power electronics. The company designs GaNFast integrated gallium nitride (GaN) power ICs as well as GeneSiC silicon carbide (SiC) MOSFETs, SiCPAK power modules, and SiC MPS diodes targeting applications including mobile consumer electronics, data centers, solar, industrial, motor drive, electric vehicles, and medical. Its wide bandgap semiconductor solutions deliver best-in-class efficiency, performance, and ruggedness compared to traditional silicon-based alternatives.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Navitas Semiconductor.
Navitas Semiconductor didn’t post a salary, so this is our estimate from similar listings.
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