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© All Rights Reserved. ApplyBlast.com
Renesas 瑞萨电子
The Director, Package Design Engineering leads the development of advanced packaging technologies for power and AI/datacenter applications, overseeing R&D, global OSAT management, and product qualification. This role drives technology roadmaps, manages budgets, and ensures smooth transition of new packages into production while maintaining high quality standards.
作为全球领先的微控制器、模拟功率器件和SoC产品供应商，瑞萨电子通过提供可靠的创新嵌入式设计，与您共创无限未来。
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Renesas 瑞萨电子.
Renesas 瑞萨电子 didn’t post a salary, so this is our estimate from similar listings.
11% above the average for this role
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