Senior Engineer(Wirebond Process Development)

Nexperia(3 months ago)

Seremban, MalaysiaOnsiteFull TimeSenior$99,419 - $136,083 (estimated)Process Engineering

About this role

The Senior Engineer (Wirebond Process Development) leads design, development, and industrialisation of wire bonding processes for advanced semiconductor packaging. The role supports new product introductions, technology roadmap projects, and continuous improvement in high-volume manufacturing to ensure process robustness, high yield, and scalability. The position collaborates with cross-functional teams including R&D, equipment engineering, quality, and operations.

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Required Skills

Wire Bonding
Process Development
NPI
DOE
SPC
Yield Improvement
Defect Analysis
Equipment Integration
Automation
Metallurgy

+4 more

Qualifications

BS in Materials Science
MS in Materials Science
BS in Electrical Engineering
MS in Electrical Engineering
BS in Mechanical Engineering
MS in Mechanical Engineering

About Nexperia

nexperia.com

Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.

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