Senior Engineer(Wirebond Process Development)
Nexperia
About this role
The Senior Engineer (Wirebond Process Development) leads design, development, and industrialisation of wire bonding processes for advanced semiconductor packaging. The role supports new product introductions, technology roadmap projects, and continuous improvement in high-volume manufacturing to ensure process robustness, high yield, and scalability. The position collaborates with cross-functional teams including R&D, equipment engineering, quality, and operations.
Skills
Qualifications
About Nexperia
nexperia.comHeadquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.
Recent company news
SourceabilityChip industry hit by Nexperia export ban
3 days ago
ReutersNexperia China says it has begun producing its own chips
3 days ago
EvertiqNexperia dispute deepens as China unit launches independent chip production
2 days ago
The American BazaarNexperia China says it has begun producing its own chips
2 days ago
Automotive NewsNexperia owner to seek $8 billion compensation in semiconductor showdown as Dutch block China control
1 week ago
About Nexperia
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
Unlock Company Insights
View leadership team, funding history,
and employee contacts for Nexperia.
Salary
$99k – $136k
per year
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