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© All Rights Reserved. ApplyBlast.com
Nexperia
The Senior Engineer (Wirebond Process Development) leads design, development, and industrialisation of wire bonding processes for advanced semiconductor packaging. The role supports new product introductions, technology roadmap projects, and continuous improvement in high-volume manufacturing to ensure process robustness, high yield, and scalability. The position collaborates with cross-functional teams including R&D, equipment engineering, quality, and operations.
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Nexperia.
Nexperia didn’t post a salary, so this is our estimate from similar listings.
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