ApplyBlast uses AI to match you with the right jobs, tailor your resume and cover letter, and apply automatically so you can land your dream job faster.
© All Rights Reserved. ApplyBlast.com
ApplyBlast uses AI to match you with the right jobs, tailor your resume and cover letter, and apply automatically so you can land your dream job faster.
© All Rights Reserved. ApplyBlast.com
SkyWater Technology Foundry, Inc.
A Bonding Process Development Engineer at our Florida Advanced Packaging site will lead the development and improvement of bonding techniques for advanced packaging and heterogenous integration technologies. The role involves working with process flows, supporting integration, and driving yield improvements through process enhancements.
Headquarters
Bloomington, Minnesota, United States
Company Size
501-1000 employees
Founded
2017
SkyWater Technology is a U.S.-based, solely U.S.-owned, DMEA‑accredited pure‑play semiconductor foundry. The company provides advanced innovation engineering services and volume manufacturing for a wide variety of differentiated integrated circuits (ICs), supporting commercial and defense customers. SkyWater emphasizes secure domestic supply and offers turnkey capabilities from design and prototyping through production. Customers choose it for U.S. ownership, defense-grade accreditation, and specialized foundry expertise.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for SkyWater Technology Foundry, Inc..
SkyWater Technology Foundry, Inc. didn’t post a salary, so this is our estimate from similar listings.
Right around the average for this role
Advanced Packaging Bonding Engineer
ASTARPRD
Die-to-Wafer Hybrid Bonding Module Engineer
Applied Materials
Die-to-Wafer Hybrid Bonding Module Engineer
Applied Materials
SR ENGINEER, APTD Bonding / Wafer Thinning
Micron Technology
Bonding Process Control Engineer
ASTARPRD
Wafer-to-Wafer Bonding Engineer (APM)
ASTARPRD