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Senior IC Packaging Process Engineer at NVIDIA - ApplyBlast

Senior IC Packaging Process Engineer

NVIDIA

7 days ago

4.6 on Glassdoor

Yokneam, Israel

Onsite

Full Time

Senior

0 applicants

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About this role

NVIDIA is seeking a Senior IC Packaging Process Engineer to develop advanced ASIC packages by collaborating with SI, layout, and ASIC design teams. The role involves planning schedules, resolving costs, and addressing packaging, manufacturing, and electrical design issues. The engineer will lead adhesive and bonding process development, design experiments, and qualify new materials to ensure production readiness and yield improvements.

Responsibilities

Lead adhesive and bonding process development for advanced FCBGA packaging
Design and execute Design of Experiments for adhesive material qualification and process optimization
Evaluate and qualify new materials from vendors including characterization of cure chemistry and mechanical properties