Altera
An experienced Semiconductor Package Reliability Engineer at Altera characterizes and qualifies advanced 2.5D/3D semiconductor packages. The role involves partnering with development and manufacturing teams to select packaging materials based on thermal and thermomechanical characterization. Responsibilities include developing finite element models, executing reliability evaluations, and performing lifetime prediction modeling to validate package robustness.
Headquarters
San Jose, California, United States
Company Size
1001-5000 employees
Founded
1983
Altera empowers innovators with scalable FPGA and SoC solutions, spanning high-performance to power- and cost-optimized devices. These devices are designed for cloud, network, and edge applications, enabling flexible acceleration and deployment. The company positions itself as a catalyst for innovation, providing adaptable hardware platforms for diverse workloads. Altera’s mission is to accelerate innovators by delivering versatile programmable logic solutions.
50% above the average for this role
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