Arago
A Senior Packaging Engineer at Arago leads integrated circuit packaging initiatives from conceptualization to manufacturing ramp-up, managing supply chains and sub-contractors for cutting-edge AI and semiconductor devices. The role requires deep expertise in heterogeneous integration, photonic packaging, and advanced simulation tools to ensure high-yield industrialization and cross-functional alignment across optical and electrical teams.
Arago is an AI and computer hardware company developing an energy-efficient photonic AI accelerator chip powered by light. The chip is designed to deliver 10×–30× reductions in energy consumption for AI workloads, leveraging light as a computing principle to maximize performance per watt. Arago also develops CARLOTA®, a software stack that interfaces with PyTorch to enable seamless deployment of AI models on its hardware.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Arago.
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