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© All Rights Reserved. ApplyBlast.com
Qualcomm Incorporated
This role involves leading end-to-end packaging technology and product integration for RF Front End Modules, spanning technology development, NPI, and high-volume manufacturing. The position requires a senior technical specialist to drive Si and GaAs packaging processes, manage wafer-level interconnect, and ensure robust, scalable solutions for cellular and wireless data markets. The role includes cross-functional leadership, technology transfer to OSATs, and continuous improvement of yield, quality, and reliability.
Headquarters
San Diego, California, United States
Company Size
10001+ employees
Founded
1985
Qualcomm is a global semiconductor and telecommunications company that designs wireless technologies and platform solutions, best known for its Snapdragon mobile SoCs, 5G modems, and RF front‑end components. The company focuses on high‑performance, low‑power computing and on‑device AI, as well as unrivaled connectivity to enable smartphones, automotive systems, XR, IoT, and edge applications. Qualcomm pairs chip design and system software with extensive patent licensing and a broad OEM/developer ecosystem to accelerate industry transformation through 5G, AI, and “intelligent computing everywhere.”
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Qualcomm Incorporated.
Qualcomm Incorporated didn’t post a salary, so this is our estimate from similar listings.
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