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Delos Data
The Senior Packaging Engineer will architect and deliver advanced multi-die IC packages for high-performance AI accelerators, focusing on package architecture, substrate design, manufacturability, and vendor engagement. The role collaborates with IC design, physical design, SI/PI, and board teams to ensure package requirements meet system-level needs and supports package bring-up, failure analysis, and qualification.
Delos Data is a technology company building interconnect infrastructure purpose-built for AI inference, combining software, systems, and silicon expertise. Their flagship product, Nonstop AI™, enables large-scale GPU clusters with a one-hop, open architecture that improves how compute is distributed and memory is interconnected. They focus on scaling AI inference beyond traditional HPC and cloud approaches to deliver faster, more capable intelligence.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Delos Data.
55% above the average for this role