Renesas 瑞萨电子
Renesas is seeking a Staff Package Design Engineer to design and deliver next-generation, high-performance semiconductor package solutions for automotive, industrial, and IoT applications. This role involves working at the intersection of IC design, advanced package development, and system-level implementation to support world-class product portfolios. The position requires strong technical depth in package layout execution, manufacturability, and cross-domain co-design with global engineering teams.
作为全球领先的微控制器、模拟功率器件和SoC产品供应商,瑞萨电子通过提供可靠的创新嵌入式设计,与您共创无限未来。
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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Renesas 瑞萨电子 didn’t post a salary, so this is our estimate from similar listings.
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