Senior Packaging Thermal Architect
Intel(1 month ago)
About this role
The Senior Thermal Architect leads the thermal design strategy for next-generation GPUs, AI accelerators, and data center products operating at multi-kilowatt power levels. The role focuses on defining end-to-end thermal architecture across silicon, package, and platform to enable high-performance computing at scale while meeting strict thermal targets. It is positioned within Intel Foundry’s technology and manufacturing organization supporting advanced process and packaging for foundry customers.
Required Skills
- Thermal Architecture
- Thermal Design
- Advanced Packaging
- 3DIC
- Chiplets
- Heterogeneous Integration
- Thermal Simulation
- CFD
- FEA
- Experimental Validation
+6 more
Qualifications
- MS in Mechanical Engineering
- PhD in Mechanical Engineering
About Intel
intel.comIntel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.
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