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© All Rights Reserved. ApplyBlast.com
Qnity
The Senior Scientist, Advanced Packaging role at Qnity involves leading the research and development of next-generation copper electroplating solutions for dual damascene interconnect applications in advanced electronics. The position requires designing, formulating, and scaling advanced Cu plating chemistries to improve feature filling performance, reliability, and manufacturing productivity for leading-edge semiconductor technology nodes. This role demands strong experimental skills, cross-functional collaboration, and the ability to creatively solve complex technical problems in electrochemistry and materials science.
Company Size
1-10 employees
Explore Qnity Electronics (formerly DuPont Electronics), a global leader in high-performance computing and advanced connectivity. Discover AI-powered interconnect innovations, advanced packaging, and sustainable PCB technologies driving the future of semiconductors.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Qnity.
Qnity didn’t post a salary, so this is our estimate from similar listings.