Senior Wire Bond Equipment & Process Engineer
Nexperia(1 month ago)
About this role
A Senior Wire Bond Equipment & Process Engineer who applies expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure product quality and reliability. The role partners with R&D, process engineering, and manufacturing teams to support new product introductions and continuous improvement initiatives.
Required Skills
- Wire Bonding
- Thermosonic Bonding
- Ultrasonic Bonding
- Bonder Programming
- Process Optimization
- Troubleshooting
- DOE
- Statistical Analysis
- FMEA
- SPC
+2 more
Qualifications
- Bachelor's Degree in Electrical/Electronic/Mechanical Engineering or Materials Science
About Nexperia
nexperia.comHeadquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.
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