Senior/Staff Wire Bond Equipment & Process Engineer

Nexperia(26 days ago)

Seremban, MalaysiaOnsiteFull TimeSenior$99,872 - $136,686 (estimated)Process Engineering

About this role

Senior Wire Bond Equipment & Process Engineer responsible for optimizing and qualifying wire bonding equipment and processes to ensure high-quality, reliable semiconductor production. The role collaborates with R&D, process engineering, and manufacturing teams to drive continuous improvement, support new product introductions, and maintain compliance with industry standards.

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Required Skills

Wire Bonding
Thermosonic Bonding
Ultrasonic Bonding
ASM Bonders
Bonder Programming
Process Optimization
Troubleshooting
Design Of Experiments
FMEA
SPC

+5 more

Qualifications

BS in Electrical/Electronic Engineering
BS in Mechanical Engineering
BS in Materials Science

About Nexperia

nexperia.com

Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.

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