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© All Rights Reserved. ApplyBlast.com
Navitas Semiconductor
This leadership role is responsible for developing and executing the SiC power module technology roadmap for high-voltage and ultra-high-voltage product platforms. The position involves building and leading a global engineering organization to drive the development of advanced power module packaging technologies from concept through production release. The role requires establishing module architectures, design rules, and manufacturing processes to ensure industry-leading performance, reliability, and cost efficiency.
Headquarters
Torrance, California, United States
Company Size
201-500 employees
Founded
2014
Navitas Semiconductor is the only pure-play, next-generation power semiconductor company, founded in 2014 to enable a high-speed revolution in power electronics. The company designs GaNFast integrated gallium nitride (GaN) power ICs as well as GeneSiC silicon carbide (SiC) MOSFETs, SiCPAK power modules, and SiC MPS diodes targeting applications including mobile consumer electronics, data centers, solar, industrial, motor drive, electric vehicles, and medical. Its wide bandgap semiconductor solutions deliver best-in-class efficiency, performance, and ruggedness compared to traditional silicon-based alternatives.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Navitas Semiconductor.
Navitas Semiconductor didn’t post a salary, so this is our estimate from similar listings.
25% above the average for this role
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