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Silicon Photonics Advanced Packaging Intern (Summer 2027) at GlobalFoundries - ApplyBlast

Silicon Photonics Advanced Packaging Intern (Summer 2027)

GlobalFoundries

2 days ago

3.5 on Glassdoor

Malta, New York, United States

Onsite

Internship

Intern

0 applicants

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About this role

GlobalFoundries is seeking a Summer 2027 intern to support the development of electro-optical transceivers using its Photonix platform and advanced co-packaged optics form factors. This hands-on role involves contributing to thermal, mechanical, electrical, and optical chip-package co-design to enhance module performance, reliability, and packaging design. The intern will collaborate with internal teams and OSAT partners to drive packaging innovation and customer design enablement.

Responsibilities

Support silicon photonics advanced packaging innovation and customer design enablement
Participate in cross-functional design reviews to resolve technical and manufacturability concerns
Develop and apply analysis or simulation models to evaluate package performance and quality

Skills

Qualifications

Bachelor's degree in Electrical EngineeringBachelor's degree in Mechanical EngineeringBachelor's degree in Materials ScienceBachelor's degree in PhotonicsBachelor's degree in Optical Engineering

About GlobalFoundries

gf.com

Headquarters

Malta, New York, United States

Company Size

10001+ employees

Founded

2009

View Profile

GlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.