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SMTS - 3D Heterogeneous Integration (all things TSV) at GlobalFoundries - ApplyBlast

SMTS - 3D Heterogeneous Integration (all things TSV)

GlobalFoundries

1 year ago

3.5 on Glassdoor

Singapore

Onsite

Full Time

Senior

0 applicants

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About this role

GlobalFoundries is hiring an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer focused on advancing TSV/TOV and related post-processing technologies for advanced packaging. The role supports development and maturation of new 2.5D/3D integration capabilities within the Singapore fab environment, working across internal teams and external ecosystem partners. The position also contributes to technology innovation and long-term packaging roadmaps.

Skills

Qualifications

Master’s in Electrical EngineeringMaster’s in Mechanical EngineeringMaster’s in Chemical EngineeringMaster’s in Materials SciencePhD (Preferred)

About GlobalFoundries

gf.com

Headquarters

Malta, New York, United States

Company Size

10001+ employees

Founded

2009

View Profile

GlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.