SMTS - 3D Heterogeneous Integration (all things TSV)

GlobalFoundries(4 months ago)

SingaporeOnsiteFull TimeSenior$192,680 - $257,808 (estimated)Research & Development

About this role

GlobalFoundries is hiring an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer focused on advancing TSV/TOV and related post-processing technologies for advanced packaging. The role supports development and maturation of new 2.5D/3D integration capabilities within the Singapore fab environment, working across internal teams and external ecosystem partners. The position also contributes to technology innovation and long-term packaging roadmaps.

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Required Skills

3DHI
TSV
TOV
RDL
Wafer Thinning
Reveal Process
Process Development
Process Integration
Advanced Packaging
Yield Improvement

+13 more

Qualifications

Master’s in Electrical Engineering
Master’s in Mechanical Engineering
Master’s in Chemical Engineering
Master’s in Materials Science
PhD (Preferred)

About GlobalFoundries

gf.com

GlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.

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