MTS Process Integration Engineer, APTD
micron
About this role
As a Process Integration Engineer for Advanced Packaging at Micron Technology, you will own the end-to-end integration of next-generation package architectures like 2.5D, 3D stacking, HBM memory integration, and hybrid bonding. This role emphasizes new technology development and technology transfer while coordinating across multiple teams to deliver high-performance multi-die technology.
Skills
Qualifications
About micron
micron.comMicron Technology, Inc. is a global leader in semiconductors. It provides a broad range of performance-enhancing memory and storage solutions. Headquartered in Boise, Idaho, Micron serves customers worldwide with its memory and storage products. The company is recognized for its global reach and leadership in the semiconductor industry.
About micron
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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and employee contacts for micron.
Salary
$147k – $197k
per year
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