Micron Technology
This role serves as a key technical contributor within the Heterogeneous Integration Group, responsible for defining and driving sign-off quality physical verification flows for next-generation HBM logic die and memory-centric SoCs. The position requires collaboration across physical design, EDA tool teams, and foundry interfaces to deliver tape-out-ready silicon under aggressive schedule and quality constraints. The engineer will ensure design integrity from layout through first silicon by managing full-chip verification and reliability checks.
Micron Technology, Inc. is a global leader in semiconductors, specializing in the design and manufacturing of memory and storage solutions including DRAM, NAND flash, HBM, and SSDs. The company serves a broad range of markets including AI and data centers, automotive, mobile, client PC, and industrial IoT. Headquartered in Boise, Idaho, Micron is recognized for its technology leadership and ongoing U.S. manufacturing expansion.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Micron Technology.
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