Amkor Technology
Amkor Technology is seeking a Senior Director to lead the strategy, development, and execution of advanced chiplet-based module technologies, including HDFO and FCBGA solutions for AI, computing, and networking markets. This role serves as a key interface with Tier 1 customers and Amkor's R&D center in South Korea, driving technology roadmaps and the commercialization of next-generation packaging solutions. The position involves leading cross-functional teams, managing program objectives, and identifying opportunities to expand Amkor's advanced packaging capabilities.
Headquarters
Tempe, Arizona, United States
Company Size
10001+ employees
Founded
1968
World's largest US-based semiconductor packaging & test services provider. Advanced OSAT solutions for global chip manufacturers.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Amkor Technology.
Amkor Technology didn’t post a salary, so this is our estimate from similar listings.
5% above the average for this role
Director, Chiplets/FCBGA Integration
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