SR ENGINEER, PACKAGE PRE STACKING
Eightfold(2 months ago)
About this role
The role involves advanced package technology research and development specifically for HBM products, focusing on wafer dicing techniques and assembly processes. Candidates will work with external suppliers to develop equipment and materials, applying advanced dicing tools and engaging in meticulous problem-solving regarding process development.
Required Skills
- Wafer Dicing
- Process Development
- Dicing Tool Operation
- Material Evaluation
About Eightfold
eightfold.aiMaximize your workforce's potential with our advanced AI Talent Intelligence Platform for talent acquisition and development. Unlock the full potential of your workforce today.
View more jobs at Eightfold →Apply instantly with AI
Let ApplyBlast auto-apply to jobs like this for you. Save hours on applications and land your dream job faster.
More jobs at Eightfold
Similar Jobs
Associate Engineer (Backgrind & Dicing)
GlobalFoundries(1 month ago)
Dicing Specialist, Silicon Assembly (Starlink)
SpaceX(24 days ago)
Associate Engineer (Backgrind &Dicing)
GlobalFoundries(1 month ago)
Senior Program Manager
Intel(2 months ago)
Wafer Dicing Technician
Teledyne Defense Electronics, LLC(20 days ago)
Package Technology Development Manager
Monolithic Power Systems(6 months ago)