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infineon
This role involves developing and optimizing semiconductor packaging processes, particularly Trim and Form operations, by establishing assembly capabilities, supporting prototype builds, and leading technical knowledge transfer to operations. Candidates will drive supplier liaisons for tooling validation, generate critical quality documents like PFMEA and Control Plans, and lead statistical problem-solving teams using analytical data methods.
Infineon Technologies is a global semiconductor company that delivers chips and system solutions for automotive, industrial, IoT, and consumer markets. Its product portfolio includes microcontrollers, sensors, power-management ICs and power semiconductors (e.g., MOSFETs/IGBTs), memories, connectivity (USB, Bluetooth, Wi‑Fi), LED drivers, security controllers and radiation‑hardened devices. Infineon focuses on energy efficiency, safety and security to enable applications from electric vehicles and industrial drives to smart-home and IoT devices. OEMs and system designers choose Infineon for its integrated hardware/software solutions, reliability, and global support.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for infineon.
infineon didn’t post a salary, so this is our estimate from similar listings.
137% above the average for this role
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