STMicroelectronics
The FOL Lead Process Engineer leads the development, optimization, and sustaining of Front-Of-Line assembly processes, focusing on Pre-Assembly, Die Attach, and Wire Bond. This role ensures process stability, product quality, and yield enhancement while driving continuous manufacturing excellence in a high-volume semiconductor environment. The position involves leading process improvement initiatives, coaching engineering teams, and facilitating knowledge transfer from NPI to production.
Headquarters
Plan-Les-Ouates, Geneva, Switzerland
Company Size
10001+ employees
Founded
1987
ST is a global high-tech company creating semiconductor technologies for a smarter, greener, and more sustainable future
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for STMicroelectronics.
STMicroelectronics didn’t post a salary, so this is our estimate from similar listings.
18% below the average for this role
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