Broadcom
This role involves managing interactions with IC substrate subcontractors to resolve packaging, manufacturing, and quality issues for high-volume semiconductor devices. The position will lead new product introduction activities, drive process improvements, and ensure compliance with Broadcom's requirements across various engineering teams. Candidates will focus on NPI, yield enhancement, and operational standardization within substrate manufacturing environments.
Headquarters
Palo Alto, California, United States
Company Size
10001+ employees
Founded
1991
Broadcom Inc. is a global technology leader that designs, develops, and supplies a comprehensive range of semiconductor and enterprise software solutions. The company's offerings include a variety of security solutions and products aimed at enhancing connectivity across various sectors. With a commitment to innovation and quality, Broadcom is at the forefront of driving technological advancements that connect everything, from data centers to mobile devices.
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Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Broadcom.
17% above the average for this role
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